GB/T 40564-2021 Test method of epoxy molding compound for electronic packaging
GB/T 40564-2021 Test method of epoxy molding compound for electronic packaging
Basic Information
Scope
This document specifies the test methods for the appearance, gelation time, screw flow length, flying edges, thermal hardness, density, thermal conductivity, viscosity, glass transition temperature, linear thermal expansion coefficient, water absorption, flame retardancy, electrical conductivity, pH value, sodium ion content, chloride ion content, bromide ion content, bromine content, antimony content, chlorine content, ash content, uranium content, flexural strength, impact strength, molding shrinkage rate, bonding strength, volume resistivity, dielectric constant, dielectric loss, and breakdown strength of epoxy encapsulants used in electronic packaging of semiconductor discrete devices, integrated circuits, and special devices.
This document is applicable to the performance testing of epoxy encapsulants used in electronic packaging of semiconductor discrete devices, integrated circuits, and special devices.