DB44/T 1088-2012 Active Guangdong ProvinceLocal standards

DB44/T 1088-2012 Test method for interlayer bonding of copper clad laminates

Publish Date: 2011-12-25 Implement Date: 2012-03-31 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: DB44/T 1088-2012

Standard Type: Local standards

Standard Status: Active

is_force_gb: no

CCS Name: Printed circuit board

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2011-12-25

Implement Date: 2012-03-31

Pages: 7 pages

Scope

This standard specifies the test method for determining the interlaminar adhesion strength of copper foil laminates, in order to characterize the bonding strength between the insulating layers of copper foil laminates. This test method includes three methods: the T-peel method, the wedge-shaped blade separation method, and the vertical tensile method. Among them, the T-peel method is the arbitration method. This test method is suitable for copper foil laminates used in printed circuits, which are reinforced with glass fiber cloth.