GB/T 5489-1985
Replaced
GB/T 13555-2017
Active
National standards
GB/T 13555-2017 Copper-clad polyimide film laminates for flexible printed circuits
GB/T 13555-2017 Copper-clad polyimide film laminates for flexible printed circuits
Basic Information
Standard Code:
GB/T 13555-2017
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Printed circuit board
ICS Name:
Printed circuits and printed circuit boards
Publish Date:
2017-12-29
Implement Date:
2019-01-01
Pages:
15 pages
Scope
This standard specifies the terminology, classification, requirements, inspection rules, packaging, marking, storage, and transportation of polyimide film-clad copper plates for flexible printed circuits. This standard applies to polyimide film-clad copper plates for flexible printed circuits (hereinafter referred to as flexible polyimide copper plates).
Development Information
Replace the following standards
Referenced Standards
GB/T 13557-2017 Test methods for copper-clad material for flexible printed circuits
GB/T 2036-1994 Terms for printed circuits
GB/T 5230-1995 Electrodeposited copper foil
GB/T 5230-2020 Electrodeposited copper foil for printed board
GB/T 13542.6-2006 Film for electrical insulation—Part 6:Polyimide films for electrical insulation
Related Standards
GB/T 12559-1990
Active
GB/T 12559-1990 The patternes series for artwork master of printed circuits
GB/T 12629-1990
Replaced
GB/T 12629-1990 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T 12630-1990
Active
GB/T 12630-1990 Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards
GB/T 12631-1990
Replaced
GB/T 12631-1990 Test method for resistance of conductor of printed boards
GB/T 13555-1992
Replaced