SJ/Z 2808-2015 Active Industry standards-Electronics

SJ/Z 2808-2015 Printed board assembly heat design

Publish Date: 2015-10-10 Implement Date: 2016-04-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Price: $ 30

Basic Information

Standard Code: SJ/Z 2808-2015

Standard Type: Industry standards

Standard Status: Active

is_force_gb: no

CCS Name: Printed circuit board

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2015-10-10

Implement Date: 2016-04-01

Pages: 18 pages

Development Information

Pages: 18 pages

Replace the following standards

SJ/Z 2808-1987 Thermal design of printed board assemblies

Related Standards

GB/T 5489-1985 Replaced

GB/T 5489-1985 Printed board drawing

Publish Date: 1985-11-01

GB/T 12559-1990 Active

GB/T 12559-1990 The patternes series for artwork master of printed circuits

Publish Date: 1990-12-08

GB/T 12629-1990 Replaced

GB/T 12629-1990 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Publish Date: 1990-12-28

GB/T 12630-1990 Active

GB/T 12630-1990 Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards

Publish Date: 1990-12-28

GB/T 12631-1990 Replaced

GB/T 12631-1990 Test method for resistance of conductor of printed boards

Publish Date: 1990-12-28

GB/T 13555-1992 Replaced

GB/T 13555-1992 Flexible copper-clad polyimide film for printed circuits

Publish Date: 1992-07-08