GB/T 14112-2015 Active National standards

GB/T 14112-2015 Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP

Publish Date: 2015-05-15 Implement Date: 2016-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 14112-2015

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Semiconductor integrated circuits

ICS Name: Integrated circuits, microelectronics

Publish Date: 2015-05-15

Implement Date: 2016-01-01

Pages: 25 pages

Scope

This standard specifies the technical requirements and inspection rules for plastic dual-row encapsulated stamping type lead frames of semiconductor integrated circuits (hereinafter referred to as lead frames). This standard is applicable to dual-row (DIP) stamping type lead frames. Single-row stamping type lead frames can also be used as a reference.

Development Information

Word Count: 45 Thousand words Pages: 25 pages

Replace the following standards

GB/T 14112-1993 Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP

Referenced Standards

GB/T 2423.60-2008 Environmental testing for electric and electronic products—Part 2:Test methods—Test U:Robustness of terminations and integral mounting devices GB/T 2828.1-2012 Sampling procedures for inspection by attributes—Part 1:Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection GB/T 7092-1993 Outline dimensions of semiconductor integrated circuits GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits GB/T 14113-1993 Terminology of packages for semiconductor integrated circuits SJ 20129-1992 Methods for measurement of metallic coating thickness

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