YS/T 641-2007 Abolished Industry standards-Non-ferrous metals

YS/T 641-2007 Aluminium wire for semiconductor lead bonding

YS/T 641-2007 Aluminium wire for semiconductor lead bonding

Publish Date: 2007-04-13 Implement Date: 2007-10-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: YS/T 641-2007
Standard Type: Industry standards
Standard Status: Abolished
is_force_gb: no
CCS Name: Light metals and their alloys
ICS Name: Aluminum products
Publish Date: 2007-04-13
Implement Date: 2007-10-01
Pages: 12 pages

Scope

This standard specifies the requirements, test methods, inspection rules, and marking, packaging, transportation, and storage for aluminum wires used in the bonding of semiconductor devices.
This standard applies to aluminum wires used in the bonding of semiconductor devices (hereinafter referred to as "aluminum wires").

Development Information

Word Count: 17 Thousand words Pages: 12 pages

Referenced Standards

GB/T 6987.2-2001 Aluminium and aluminium alloys—Determination of copper content—Oxalyldihydrazide spectrophotometric method GB/T 6987.4-2001 Aluminium and aluminium alloys—Determination of iron content—Orthopenanthroline photometric method GB/T 6987.6-2001 Aluminium and aluminium alloys—Determination of silicon content—Molybdenum blue spectrophotometric method GB/T 6987.9-2001 Aluminium and aluminium alloys—Determination of zine content—Flame atomic absorption spectrometric method GB/T 6987.17-2001 Aluminium and aluminium alloys—Determination of magnesium content—Flame atomic absorption spectrometric method YS/T 244.1-2008 Chemical analysis methods of high purity aluminum—Part 1:Determination of iron content by 1,10-phenanthroline-thiocyanate photometric method YS/T 244.2-2008 Chemical analysis methods of high purity aluminum—Part 2:Determination of silicon content by extraction-molybdenum blue photometric method YS/T 244.3-2008 Chemical analysis methods of high purity aluminum—Part 3:Determination of titanium content by diantipyrylmethane-thiocyanate photometric method YS/T 244.4-2008 Chemical analysis methods of high purity aluminum—Part 4:Determination of gallium content by butylrhodamine B photometric method YS/T 244.5-2008 Chemical analysis methods of high purity aluminum—Part 5:Determination of copper,zinc and lead content by anodic spripping voltammetric method YS/T 244.6-2008 Chemical analysis methods of high purity aluminum—Part 6:Determination of silver content by calalyze reaction system of manganese-persulfric acid method YS/T 244.7-2008 Chemical analysis methods of high purity aluminum—Part 7:Determination of cadmium content by extraction-dithizone photometric method YS/T 244.8-2008 Chemical analysis methods of high purity aluminum—Part 8:Determination of indium content by extraction-crystal violet photometric method YS/T 244.9-2008 Chemical analysis methods of high purity aluminum—Part 9:Determination of trace impurities in high purity aluminumby inductively coupled mass spectrometry

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