SJ/Z 21356-2018 Active Industry standards-Electronics

SJ/Z 21356-2018 Design guidelines for flip chip bonding process of SiP products

Publish Date: 2018-01-18 Implement Date: 2018-05-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Price: $ 30

Basic Information

Standard Code: SJ/Z 21356-2018

Standard Type: Industry standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: -

Publish Date: 2018-01-18

Implement Date: 2018-05-01

Pages: 13 pages

Scope

This guidance technical document specifies the general and detailed requirements for the design of the flip-chip process of system-level packaging (SiP) products. This guidance technical document is applicable to the process design of flip-chip packaging for SiP products.

Development Information

Pages: 13 pages

Referenced Standards

GB/T 14113-1993 Terminology of packages for semiconductor integrated circuits GJB 3243-1998 SJ 20710-1998 SJ/T 10414-2015 Solder used for semiconductor devices SJ/T 10668-2002

Related Standards

DZ/T 0101.12-1994 Active

DZ/T 0101.12-1994 Geological instrument manufacturing time quota for printed circuit board

Publish Date: 1994-01-27

JJG 204-1980 Active

JJG 204-1980 Meteorological Ventilation Psychrometer

Publish Date: 1980-07-11

SC 53-1980 Active

SC 53-1980 Transfer blade hydraulic steering gear repair quality standard

Publish Date: 1981-07-01

DZ 4-1981 Replaced

\nDZ 4-1981 Method for Compiling Product Models of Geological Instrumentation Equipment

Publish Date: 1981-08-20

SC 69-1982 Active

SC 69-1982 ZSS-12 Flash-type seawater desalination production device technical specifications

Publish Date: 1982-01-20

SC 72-1982 Active

SC 72-1982 Steel Fishing Boat Builder Quality Standards and Mooring Equipment Installation Technical Requirements

Publish Date: 1982-03-30