DB35/T 1356-2013 Active Fujian ProvinceLocal standards

DB35/T 1356-2013 Halogen-free epoxy fiberglass cloth bonding sheet for multilayer printed circuit board prepreg

Publish Date: 2013-08-01 Implement Date: 2013-11-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: DB35/T 1356-2013

Standard Type: Local standards

Standard Status: Active

is_force_gb: no

CCS Name: Printed circuit board

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2013-08-01

Implement Date: 2013-11-01

Pages: 16 pages

Scope

This standard specifies the terms and definitions, models, requirements, test methods, inspection rules, marking, packaging, transportation, and storage of pre-impregnated materials made from halogen-free epoxy fiberglass cloth for multilayer printed circuit boards. This standard applies to pre-impregnated materials made from epoxy fiberglass cloth for multilayer printed circuit boards, in which the bromine (Br) and chlorine (Cl) contents (by mass fraction) are less than 0.09%, and the total bromine and chlorine content (by mass fraction) is less than 0.15% (hereinafter referred to as "bonding sheets").