DZ/T 0101.12-1994
Active
SJ 21334-2018
Active
Industry standards-Electronics
SJ 21334-2018 Ceramic packages and metal packages Technical requirements for nickel electroplating process
SJ 21334-2018 Ceramic packages and metal packages Technical requirements for nickel electroplating process
Price:
$ 30
Basic Information
Standard Code:
SJ 21334-2018
Standard Type:
Industry standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
-
Publish Date:
2018-01-18
Implement Date:
2018-05-01
Pages:
15 pages
Scope
This standard specifies the requirements for the nickel plating process of ceramic and metal housings and their components used in microelectronic packaging. This standard is applicable to the nickel plating process of ceramic and metal housings and their components.
Development Information
Referenced Standards
GB 12348-1990 Standard of noise at boundary of industrial enterprises
GB 21900
GB/T 2054-2013 Nickel and nickel alloy plate and sheet
GB/T 23847-2009 Nickel sulfamate for electroplating
GB/T 26522-2011 Refined nickel chloride
GB/T 622-2006 Chemical reagent—Hydrochloric acid
GB/T 625-2007 Chemical reagent—Sulfuric acid
GJB 1420B-2011
GJB 2440A-2006
HG/T 4020-2008 HG/T 4020-2008 Chemical reagent: Hexahydrated nickel sulfate (nickel sulfate)
HJ/T 314-2006 Clean Production Standards - Electroplating Industry
SJ 20129-1992 Methods for measurement of metallic coating thickness
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