SJ 21334-2018 Active Industry standards-Electronics

SJ 21334-2018 Ceramic packages and metal packages Technical requirements for nickel electroplating process

SJ 21334-2018 Ceramic packages and metal packages Technical requirements for nickel electroplating process

Publish Date: 2018-01-18 Implement Date: 2018-05-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: SJ 21334-2018
Standard Type: Industry standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: -
Publish Date: 2018-01-18
Implement Date: 2018-05-01
Pages: 15 pages

Scope

This standard specifies the requirements for the nickel plating process of ceramic and metal housings and their components used in microelectronic packaging. This standard is applicable to the nickel plating process of ceramic and metal housings and their components.

Development Information

Pages: 15 pages

Referenced Standards

Related Standards

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