YS/T 1105-2024 Active Industry standards-Non-ferrous metals

YS/T 1105-2024 Bonding silver wire for semiconductor packaging YS/T 1105-2024

Publish Date: 2024-10-24 Implement Date: 2025-05-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: YS/T 1105-2024

Standard Type: Industry standards

Standard Status: Active

is_force_gb: no

CCS Name: Precious metals and their alloys

ICS Name: Other non-ferrous metal products

Publish Date: 2024-10-24

Implement Date: 2025-05-01

Scope

This document is applicable to bonding silver wires used in semiconductor packaging

Development Information

Replace the following standards

YS/T 1105-2016 Silver bonding wire for semiconductor package

Related Standards

GB/T 15678-1995 Replaced

GB/T 15678-1995 Erbium oxide

Publish Date: 1995-08-11

GB/T 17168-1997 Replaced

GB/T 17168-1997 Dental casting precious metal alloys

Publish Date: 1997-12-22

GB/T 4062-1998 Replaced

GB/T 4062-1998 Antimony trioxide

Publish Date: 1998-07-15

GB/T 13560-2000 Replaced

GB/T 13560-2000 Materials for sintered neodymium iron boron permanent magnets

Publish Date: 2000-06-05

GB/T 18113-2000 Replaced

GB/T 18113-2000 Heating element of lanthanum chromite in high temperature

Publish Date: 2000-06-05

GB/T 9967-2001 Replaced

GB/T 9967-2001 Neodymium metal

Publish Date: 2001-05-29