GB/T 2413-1981
Active
SJ/T 11390-2019
Active
Industry standards-Electronics
SJ/T 11390-2019 Lead-free soldering test methods
SJ/T 11390-2019 Lead-free soldering test methods
Basic Information
Standard Code:
SJ/T 11390-2019
Standard Type:
Industry standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic devices and specialized materials, parts, and structural components
ICS Name:
Special materials for electronic technology
Publish Date:
2019-12-24
Implement Date:
2020-07-01
Scope
This standard specifies the test methods for the melting temperature, mechanical tensile strength, expansion, wetting, solder joint tensile and shear strength, QFP lead solder joint 45° tensile strength, chip component solder joint shear strength, and spatter of core-coated solder wires of lead-free solders.
Development Information
Replace the following standards
Related Standards
GB/T 3389.4-1982
Replaced
GB/T 3389.4-1982 Test methods for the properties of piezoelectric ceramics—Longitudinal length extension vibration mode for rod
GB/T 5594.1-1985
Active
GB/T 5594.1-1985 Test methods for properties of structure ceramic used in electronic components—Test method for gas-tightness
GB/T 5594.2-1985
Active
GB/T 5594.2-1985 Test methods for properties of structure ceramic used in electronic components—Test method for Youngs elastic modulus and Poisson ratio
GB/T 5594.3-1985
Replaced
GB/T 5594.3-1985 Test methods for properties of structure ceramic used in electronic components—Test method for mean coefficient of linear expansion
GB/T 5594.4-1985
Replaced