DB44/T 1555-2015 Active Guangdong ProvinceLocal standards

DB44/T 1555-2015 The method for testing interconnection stress of high-density printed circuit board

Publish Date: 2015-03-26 Implement Date: 2015-06-26 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: DB44/T 1555-2015

Standard Type: Local standards

Standard Status: Active

is_force_gb: no

CCS Name: Broadcasting and television equipment

ICS Name: Audio, video, and audiovisual engineering

Publish Date: 2015-03-26

Implement Date: 2015-06-26

Pages: 10 pages

Scope

This standard specifies the stress testing method for plated hole interconnections on high-density interconnected printed circuit boards (HDI boards), including the design requirements for the interconnection stress test attachment board, the testing process, and the failure determination. This method is applicable to high-density interconnected printed circuit boards with plated holes or micro-via holes of six layers or more.