GB/T 15678-1995
Replaced
GB/T 34507-2017
Active
National standards
GB/T 34507-2017 Palladium coated copper bonding wire for semiconductor package
GB/T 34507-2017 Palladium coated copper bonding wire for semiconductor package
Basic Information
Standard Code:
GB/T 34507-2017
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Precious metals and their alloys
ICS Name:
Other non-ferrous metal products
Publish Date:
2017-10-14
Implement Date:
2018-05-01
Pages:
17 pages
Scope
This standard specifies the requirements for palladium-plated copper wires used in semiconductor packaging, including discrete devices, integrated circuits, and LED packaging, as well as the testing methods, inspection rules, marking, packaging, transportation, storage, quality certificates, and purchase orders (or contracts). This standard applies to palladium-plated copper wires used in semiconductor packaging.
Development Information
Referenced Standards
GB/T 5121.27-2008 Methods for chemical analysis of copper and copper alloys—Part 27:The inductively coupled plasma atomic emission spectromertric method
GB/T 10573-1989 Tensile testing method for fine wire of non-ferrous metals
GB/T 10573-2020 Tensile testing method for fine wire of nonferrous metals
YS/T 716.7-2016 Methods for chemical analysis of low grade blister—Part 7:Determination of platinum and palladium contents—Fire assay collection-inductively coupled plasma-atomic emission spectrometric methods and flame atomic absorption spectrometric methods
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