GB/T 3047.6-1986
Replaced
GB/T 19520.21-2023
Active
National standards
GB/T 19520.21-2023 Mechanical structures for electrical and electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-109:Dimensions of chassis for embedded computing devices
GB/T 19520.21-2023 Mechanical structures for electrical and electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-109:Dimensions of chassis for embedded computing devices
Basic Information
Standard Code:
GB/T 19520.21-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Mechanical structure of electrical products
ICS Name:
Mechanical components for electronic devices
Publish Date:
2023-11-27
Implement Date:
2024-06-01
Publisher:
国家市场监督管理总局、国家标准化管理委员会
Technical Committee:
全国电工电子设备结构综合标准化技术委员会(SAC/TC 34)
Pages:
23 pages
Scope
本文件规定了机箱及其印制板的尺寸和物理性能,从而为嵌入式计算设备提供机械和环境完整性。嵌入式计算设备应用于机器控制、医疗、运输、航空航天以及通信等各种场合,它们通常基于单板计算机。
为便于确定合适的机箱及其单板尺寸,本文件基于44.45 mm(1.75 in)的结构网格。
Development Information
Drafting Units:
中国电子科技集团公司第三十六研究所、机械工业北京电工技术经济研究所、厦门坤锦电子科技有限公司、国电南京自动化股份有限公司、厦门三行电子有限公司、烽火通信科技股份有限公司、中兴通讯股份有限公司、南京南瑞继保电气有限公司、北京四方继保工程技术有限公司、浙江辉日环境检测有限公司、默飓电气有限公司、深圳市锐扬创科技术股份有限公司、山东盛帆电子科技有限公司、广东飞成新材料有限公司、义乌市老金模具有限公司、广东橙杏检测有限公司、浙江如晶科技有限公司、广东超勇检测技术有限公司、中国电器工业协会
Drafting Persons:
金大元、李剑侠、黄树福、包安群、崔瑜、黄景明、万云、王蔚、尹东海、韩造林、陈双节、木林森、汤建强、褚翔、张龙、段春芳、金庆和、王姗姗、肖本崇、倪燎勇
Same series standard
GB/T 19520.20-2023 Mechanical structures for electrical and electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-108:Dimensions of R-type subracks and plug-in units
GB/T 19520.22-2023 Mechanical structures for electrical and electronic equipment—Dimensions of mechanical structures of the 482.6 mm(19 in) series—Part 3-110:Residential racks and cabinets for smart houses
Referenced Standards
IEC 60297-3-100
IEC 60529
IEC 61587-1
IEC 61587-3
IEC 61587-5
Adopt standards
IEC 60297-3-109:2015
Related Standards
GB/T 6431-1986
Abolished
GB/T 6431-1986 Basic dimensions of narrow frame used for telecommunication equipment
GB/T 7423.1-1987
Active
GB/T 7423.1-1987 Heat sink of semiconductor devices Generic specification
GB/T 7423.2-1987
Active
GB/T 7423.2-1987 Heat sink of smiconductor devices Heat sink, extruded shapes
GB/T 7423.3-1987
Active
GB/T 7423.3-1987 Heat sink of semiconductor devices Heat sink, Staggered fingers shapes
GB/T 3047.2-1992
Abolished