PDF
T/CI 831-2024 Active
T/CI 831-2024 PCB Dry Film Photoresist Technical Requirements
Abstract
This document specifies the technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage for dry film photoresist used in printed circuit boards (PCBs). This document is applicable to dry film photoresist used in PCB manufacturing.
General Product Information
| Document Type | Group standards |
|---|---|
| Standard Status | Active |
| Standard Code | T/CI 831-2024 |
| Implement Date | 1970-01-01 |
Price
$ 31.00
Subtotal
$ 31.00
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$ 0.00
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$ 31.00