GB/T 4937.15-2018 Active
GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices
Abstract
This part of GB/T 4937 specifies the test method for resistance to welding heat, in order to determine the ability of solid-state packaging devices installed via through-hole mounting to withstand the thermal stress generated during wave soldering or soldering with a soldering iron.
To establish reproducible standard test procedures, the immersion soldering test method, which is easier to control the test conditions, is selected. This procedure is used to determine the device's tolerance to the required welding temperature when it is assembled onto a circuit board, ensuring that the electrical performance of the device does not degrade and the internal connections are not damaged.
This test is a destructive test and can be used for qualification, batch acceptance, and product inspection.
This test is basically consistent with IEC 60068-2-20, but in view of the special requirements of semiconductor devices, the provisions of this part are adopted.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 4937.15-2018 |
| CCS | Semiconductor discrete devices |
| ICS | Integrated Components of Semiconductor Devices |
| Implement Date | 2019-01-01 |