SJ/T 11779-2021 Active Industry standards-Electronics

SJ/T 11779-2021 SJ/T 11779-2021 Copper foil with heat-conductive resin for printed circuit board

Publish Date: 2021-03-05 Implement Date: 2021-06-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Price: $ 30

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Basic Information

Standard Code: SJ/T 11779-2021

Standard Type: Industry standards

Standard Status: Active

is_force_gb: no

CCS Name: Printed circuit board

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2021-03-05

Implement Date: 2021-06-01

Development Information

Related Standards

GB/T 5489-1985 Replaced

GB/T 5489-1985 Printed board drawing

Publish Date: 1985-11-01

GB/T 12559-1990 Active

GB/T 12559-1990 The patternes series for artwork master of printed circuits

Publish Date: 1990-12-08

GB/T 12629-1990 Replaced

GB/T 12629-1990 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Publish Date: 1990-12-28

GB/T 12630-1990 Active

GB/T 12630-1990 Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards

Publish Date: 1990-12-28

GB/T 12631-1990 Replaced

GB/T 12631-1990 Test method for resistance of conductor of printed boards

Publish Date: 1990-12-28

GB/T 13555-1992 Replaced

GB/T 13555-1992 Flexible copper-clad polyimide film for printed circuits

Publish Date: 1992-07-08