T/SDZDH 002-2021 Industrial Internet Identifier Resolution Instrument Instrument Identifier Carrier Application Guide
T/SDZDH 002-2021 Industrial Internet Identifier Resolution Instrument Instrument Identifier Carrier Application Guide
Basic Information
Scope
Scope: This document specifies the objects of industrial Internet identification in the instrumentation industry, the types of identification carriers, and the guidelines for using identification carriers. This document is applicable to passive identification carriers such as one-dimensional barcodes, two-dimensional barcodes, and passive RFID tags (including NFC tags); Main technical content: The general requirements for the application of identification carriers include but are not limited to the following: — It is recommended to use one-dimensional barcodes, two-dimensional barcodes, passive RFID, and NFC tags as data carriers to establish a physical connection with the identified objects; — When using one-dimensional barcode and two-dimensional barcode tags as carriers, the identification code is usually written in its entirety. When using passive RFID and NFC tags as carriers, specific provisions will be made according to the air interface protocol and storage structure of the tags; — Clear textual identification of "Industrial Internet Identification" can be marked on the carrier; — The carrier should provide symbols or carriers that can be read by equipment, or provide digital symbols that can be read by humans; — Throughout the entire life cycle of the identified objects, the physical connection between the identification carriers and the identified objects should be ensured. For one-dimensional and two-dimensional barcode carriers, it is recommended but not limited to selecting direct printing, laser marking, and electrochemical etching on the visible positions of the identified objects, and it is recommended to install the identification carriers near the labeling positions; For passive RFID and NFC tags, it is recommended but not limited to using reactive adhesive bonding, rivet bonding, lead sealing, and embedding into the main body. For instrumentation products with protruding positions, the protruding positions should be avoided to prevent the tags fro