T/CPCA /JPCA 4306-2011 Active Group standards

T/CPCA /JPCA 4306-2011 Solder resist used in printed board

Publish Date: 2011-03-15 Implement Date: 2011-05-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CPCA /JPCA 4306-2011

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Medical electronic instruments and equipment

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2011-03-15

Implement Date: 2011-05-01

Scope

Scope: This standard specifies the technical requirements, test methods, inspection rules, and packaging, transportation, and storage for solder masking agents used on printed circuit boards. This standard applies to all types of solder masking agents used on printed circuit boards, excluding peelable solder masking agents (inks). Main technical content: - Revised the classification and grading of solder masking agents; - Introduced the terms "foaming," "hydrolysis stability," and "electromigration"; - Divided the "Requirements" chapter into two parts: "Product characteristics before use" and "Product characteristics after curing"; - Added requirements for "limit values of harmful substances," "interlayer adhesion," and "electromigration"; - Deleted the requirements for "fineness" and "photoimageability," and changed the names of items such as "printability" and "solder masking"; - Moved the test conditions for items such as "high and low temperature cycling" and "moisture test conditions for insulation resistance" to the "Test methods" chapter; - Moved the "Storage life" requirement to the "Packaging, transportation, and storage" chapter; - In the "Test methods" chapter, eliminated the "sample substrate."