T/SHSE 0003-2021 Active Group standards

T/SHSE 0003-2021 The copper-containing product resulting from the pyrolysis disposal of waste circuit boards

Publish Date: 2021-12-12 Implement Date: 2021-12-28 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/SHSE 0003-2021

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Heavy metals and their alloys

ICS Name: Copper products

Publish Date: 2021-12-12

Implement Date: 2021-12-28

Scope

Scope: This standard specifies the technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, quality certificates, and contents of purchase orders (or contracts) for products obtained after the dry distillation treatment of waste circuit boards. This standard applies to copper-containing products produced by the dry distillation carbonization process using recycled waste circuit boards as raw materials, primarily serving as raw materials for copper smelting and other fields. In addition to complying with this standard, the production and use of this product shall also comply with relevant national, local, and industry regulations, norms, and standards. Main technical content: Copper-containing products produced by the dry distillation process of waste circuit boards are classified according to the initial raw material form and chemical composition as follows: 1. Initial raw material: pure circuit boards: Grade I, Grade II, Grade III, Grade IV; 2. Initial raw material: circuit boards with attached components and circuit board frames: Grade V. The copper-containing products shall be in the form of flakes with uniform distribution and shall not contain agglomeration. The chemical composition of copper-containing products made from pure circuit boards is as follows: Grade Chemical Composition (mass fraction)/% Impurity Content,≤ Cu≥ Pb As F Cd Hg Pb + Zn MgO Bi + Sb Grade I 85 0.5 0.05 0.1 0.01 - 1 0.5 0.05 Grade II 75 0.5 0.05 0.1 0.01 - 1 0.5 0.05 Grade III 60 2 0.1 0.1 0.04 0.01 2 1 0.1 Grade IV 40 2 0.1 0.1 0.04 0.01 2 1 0.1 The chemical composition of copper-containing products made from circuit boards with attached components and circuit board frames shall comply with the following requirements: Grade Chemical Composition (mass fraction)/% Impurity Content,≤ Cu≥ Pb As F Cd Hg Pb + Zn MgO Bi + Sb Grade V 25 2 2 0.1 0.1 0.0