T/CI 831-2024 Active Group standards

T/CI 831-2024 PCB Dry Film Photoresist Technical Requirements

Publish Date: 1970-01-01 Implement Date: 1970-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CI 831-2024

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: -

Publish Date: 1970-01-01

Implement Date: 1970-01-01

Scope

This document specifies the technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage for dry film photoresist used in printed circuit boards (PCBs). This document is applicable to dry film photoresist used in PCB manufacturing.

Development Information

Word Count: 13 Thousand words

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