T/JXTX 0012-2025 Copper round wire with enamel coating for winding the bass strings of pianos

Scope

Main Technical Content: 1. Scope This document specifies the product code and representation method, technical requirements, test methods, inspection and acceptance rules, packaging, transportation, storage, accompanying documents, and order form content for enameled copper round wire used for winding piano bass strings. The enameled copper round wire specified in this document has enamel film thickness grades of Level 1 and Level 2, and the nominal diameter of the conductor ranges from 0.120mm to 2.500mm. This document applies to enameled copper round wire (hereinafter referred to as enameled copper round wire) used for winding piano bass strings. 2. Normative Reference Documents The content of the following documents is incorporated into this document through normative reference. Among them, the referenced documents with a specified date apply only to the version corresponding to that date; the unspecified date referenced documents apply to the latest version (including all amendment sheets) of the document. - GB/T 3952: Copper Wire Billets for Electrical Purposes - GB/T 4074.1: Test Methods for Winding Wires - Part 1: General Provisions - GB/T 4074.2: Test Methods for Winding Wires - Part 2: Dimensional Measurement - GB/T 4074.3: Test Methods for Winding Wires - Part 3: Mechanical Performance - GB/T 5121 (all parts): Chemical Analysis Methods for Copper and Copper Alloys - GB/T 6109.1: Enameled Round Winding Wires - Part 1: General Provisions 3. Terms and Definitions 4. Product Code and Representation Methods 4.1 Product Code 4.2 Product Representation Methods 5. Technical Requirements 5.1 Appearance 5.2 Chemical Composition 5.3 Dimensions 5.3.1 Conductor Tolerance 5.3.2 Conductor Non-roundness 5.3.3 Enamel Film Thickness 5.4 Tensile Strength and Elongation at Break 5.5 Resilience 5.6 Round Rod Winding Test 5.7 Emergency Tensile Test (for conductors with a nominal diameter of ≤1.000mm) 5.8 Peeling Test (for co

Development Information

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