T/QGCML 097-2021 Abolished Group standards

T/QGCML 097-2021 Diode Diffusion Film Packaging Technical Specification

T/QGCML 097-2021 Diode Diffusion Film Packaging Technical Specification

Publish Date: 2021-03-30 Implement Date: 2021-03-31 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/QGCML 097-2021
Standard Type: Group standards
Standard Status: Abolished
is_force_gb: no
CCS Name: Semiconductor diode
ICS Name: The comprehensive packaging and transportation of goods
Publish Date: 2021-03-30
Implement Date: 2021-03-31

Scope

Main technical content: This document specifies the process flow, general requirements, inspection, and marking for the packaging of diode diffusion sheets. This document is applicable to the packaging technical specifications of nickel-plated sheets and diffusion sheets.

Development Information

Related Standards

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