GB/T 4855-1984
Abolished
T/UNP 643-2025
Active
Group standards
T/UNP 643-2025 High-Density Heterogeneous Integrated Chip Packaging Technology Specification
T/UNP 643-2025 High-density heterogeneous integrated chip packaging technology specification
Price:
$ 20.00
Basic Information
Standard Code:
T/UNP 643-2025
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2025-04-30
Implement Date:
2025-04-30
Scope
Main technical content: This standard aims to provide comprehensive technical guidance for the packaging of high-density heterogeneous integrated chips. The standard details the technical specifications and operating procedures for components required in the packaging process, preparation for packaging, flip-chip interconnection, packaging molding, and quality acceptance, ensuring the efficiency and reliability of packaging. At the same time, clear requirements are also put forward for aspects such as marking, labeling, packaging, and file management, to guarantee the traceability and quality control of products. The implementation of this standard will promote the standardization and high-quality development of the chip packaging industry.
Development Information
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished