JG/T 111-1999
Abolished
T/ZZB 0594-2018
Active
Group standards
T/ZZB 0594-2018 Silicon wafers are cut using electroplated diamond cutting wire
T/ZZB 0594-2018 Silicon wafers are cut using electroplated diamond cutting wire
Price:
$ 20.00
Basic Information
Standard Code:
T/ZZB 0594-2018
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Knives
ICS Name:
Other cutting tools
Publish Date:
2018-10-12
Implement Date:
2018-10-31
Scope
Main technical content: This standard specifies the terms and definitions, product specifications, basic requirements, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, and quality commitments for diamond cutting wires used for silicon wafers. This standard applies to electroplated diamond cutting wires used for silicon wafers with a nominal diameter of 0.065 mm, 0.060 mm, and 0.055 mm (hereinafter referred to as diamond cutting wires).
Development Information
Related Standards
JG/T 85-1999
Abolished
JG/T 85-1999 Road grader blade
GB/T 20335-2006
Active
GB/T 20335-2006 Boring bars(tool holders with cylindrical shank)for indexable inserts—Dimensions
GB/T 20336-2006
Active
GB/T 20336-2006 Boring bars(tool holders with cylindrical shank)for indexable inserts—Designation
GB/T 10944.1-2006
Replaced
GB/T 10944.1-2006 Tool shanks with 7∶24 taper for automatic tool changers—Shanks Nos.40,45 and 50—Part 1:Dimensions and conicity tolerances
GB/T 10944.2-2006
Replaced