SJ/T 10454-1993 Abolished Industry standards-Electronics

SJ/T 10454-1993 Adhesive paste for multilayer wiring of thick film hybrid integrated circuits

Publish Date: 1993-12-17 Implement Date: 1994-06-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Price: $ 30

Out of stock

Basic Information

Standard Code: SJ/T 10454-1993

Standard Type: Industry standards

Standard Status: Abolished

is_force_gb: no

CCS Name: -

ICS Name: -

Publish Date: 1993-12-17

Implement Date: 1994-06-01

Development Information

Superseded by the following standards

SJ/T 10454-2020 Thick-film hybrid integrated circuit multilayer wiring dielectric paste

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