T/XAI 12-2021 Active Group standards

T/XAI 12-2021 Electrical Inspection Test Method for Chip-on-Film Thin Film Substrates

T/XAI 12-2021 Method for electrical inspection and testing of the film base substrate of the overmolded film electrode

Publish Date: 2021-12-06 Implement Date: 2021-12-10 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/XAI 12-2021

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Instruments and meters

ICS Name: The measurement of electrical and magnetic quantities

Publish Date: 2021-12-06

Implement Date: 2021-12-10

Scope

Scope: This document specifies the requirements for the electrical testing principles, testing conditions, testing methods, evaluation of testing results, and testing reports of flip-chip film substrates, describes the electrical inspection testing process, and provides the requirements for testing results. This document is applicable to the electrical inspection of flip-chip film substrates. Main technical contents: 1. Scope; 2. Normative referenced documents; 3. Terms and definitions; 4. Principles; 5. Testing equipment; 6. Samples; 7. Testing procedures; 8. Evaluation of testing results; 9. Testing reports