T/CIET 1007-2025 Metal packaging shell performance requirements and testing methods for integrated circuits
T/CIET 1007-2025 Metal packaging shell performance requirements and testing methods for integrated circuits
Basic Information
Scope
Scope: This document specifies the performance requirements, test methods, inspection rules, and marking, packaging, transportation, and storage for the metal encapsulation shells of integrated circuits. This document applies to the metal shells of semiconductor integrated circuits, and the metal shells of hybrid integrated circuits can be implemented in accordance with this document. Main technical content: This document specifies the performance requirements, test methods, inspection rules, and marking, packaging, transportation, and storage for the metal encapsulation shells of integrated circuits. This document applies to the metal shells of semiconductor integrated circuits, and the metal shells of hybrid integrated circuits can be implemented in accordance with this document.