T/CIET 1007-2025 Active Group standards

T/CIET 1007-2025 Metal packaging shell performance requirements and testing methods for integrated circuits

T/CIET 1007-2025 Metal packaging shell performance requirements and testing methods for integrated circuits

Publish Date: 2025-01-22 Implement Date: 2025-01-22 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
Price: $ 20.00
Out of stock

Basic Information

Standard Code: T/CIET 1007-2025
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: Integrated circuits, microelectronics
Publish Date: 2025-01-22
Implement Date: 2025-01-22

Scope

Scope: This document specifies the performance requirements, test methods, inspection rules, and marking, packaging, transportation, and storage for the metal encapsulation shells of integrated circuits. This document applies to the metal shells of semiconductor integrated circuits, and the metal shells of hybrid integrated circuits can be implemented in accordance with this document. Main technical content: This document specifies the performance requirements, test methods, inspection rules, and marking, packaging, transportation, and storage for the metal encapsulation shells of integrated circuits. This document applies to the metal shells of semiconductor integrated circuits, and the metal shells of hybrid integrated circuits can be implemented in accordance with this document.

Development Information

Related Standards

Contact Us