DB34/T 3371-2019 Active Anhui ProvinceLocal standards

DB34/T 3371-2019 Printed circuit board rigid copper clad laminate thermal conductivity determination method

Publish Date: 2019-07-01 Implement Date: 2019-09-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: DB34/T 3371-2019

Standard Type: Local standards

Standard Status: Active

is_force_gb: no

CCS Name: Analysis methods for heavy metals and their alloys

ICS Name: Copper and copper alloys

Publish Date: 2019-07-01

Implement Date: 2019-09-01

Pages: 7 pages

Scope

This standard specifies the testing principle, samples, measuring instruments, testing environment, testing steps, result calculation, and testing report for determining the thermal conductivity of rigid copper-clad laminates used in printed circuit boards (hereinafter referred to as copper-clad laminates) by the flat plate method. This standard is applicable to the determination of the thermal conductivity of copper-clad laminates with a thickness of not less than 1.00 mm, and also to the determination of the thermal conductivity of bare copper-clad laminates with a thickness of not less than 1.00 mm.