T/SOECC 006-3-2022 Active Group standards

T/SOECC 006-3-2022 Ultra-microfine copper and copper alloy round wire - Part 3: Ultra-microfine copper-tin alloy round wire

Publish Date: 2022-12-27 Implement Date: 2022-12-31 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/SOECC 006-3-2022

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Copper and copper alloys

Publish Date: 2022-12-27

Implement Date: 2022-12-31

Scope

Main Technical Content: Ultra-fine Copper and Copper Alloy Round Wires - Part 3: Ultra-fine Copper-tin Alloy Round Wires 1. Scope: Applies to the physical structure and electrical performance of ultra-fine copper-tin alloy round wires with a single wire diameter of 0.008~0.100mm (excluding), including their representation methods, model specifications, inspection rules, marking, technical requirements, chemical composition, packaging, transportation, and storage. 2. Normative Reference Documents: The content of the following documents is an essential part of this document through normative reference. Among them, the referenced documents with a specified date apply only to the version corresponding to that date; for those without a specified date, the latest version (including all amendment sheets) applies. - GB/T 4910: Tinned Copper Round Wires - GB/T 4955-2005: Metal Coatings - Coating Thickness Measurement - Anodic Dissolution Coulometry - JB/T 3135: Silver-tinned Copper Round Wires - T/SOECC 001.1-2021: High-strength High-conductivity Copper Alloy Wires - Part 1: General Provisions - T/SOECC 0061.1-2022: Ultra-fine Copper and Copper Alloy Round Wires - Part 1: General Provisions 3. Product Model Specifications - The category, grade, state, and specifications of ultra-fine copper-tin alloy round wires shall comply with Table 1. - Table 1: Grade, State, Specifications, and Surface Characteristics of Ultra-fine Copper-tin Alloy Round Wires - Nominal Diameter (mm) - State (R: Soft, Y: Hard) - CuSn0.15: No coating - B: Tinned layer - X: Silver layer - S: 0.008≤d<0.100 4. Technical Requirements 4.1 Material Requirements The chemical composition of ultra-fine copper-tin alloy round wires shall comply with the provisions of Table 2 in T/SOECC 001.1-2021 "High-strength High-conductivity Copper Alloy Wires - Part 1: General Provisions". The chemical composition range for other grades may be determined by mutual agreement between the supplier