T/TMAC 139-2025 Active Group standards

T/TMAC 139-2025 Electronic grade polyimide film for flexible copper clad laminates

T/TMAC 139-2025 Electronic grade polyimide film for flexible copper clad laminates

Publish Date: 1970-01-01 Implement Date: 1970-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/TMAC 139-2025
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: -
Publish Date: 1970-01-01
Implement Date: 1970-01-01

Scope

This document specifies the technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of electronic-grade polyimide films used in flexible printed circuit boards. This document is applicable to the production of electronic-grade polyimide films used in flexible printed circuit boards.

Development Information

Word Count: 19 Thousand words

Related Standards

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