T/ACCEM 338-2024 Active Group standards

T/ACCEM 338-2024 Surface acoustic wave filter chip device module structure packaging process and testing specification

T/ACCEM 338-2024 Surface acoustic wave filter chip device module structure packaging process and testing specification

Publish Date: 2024-12-05 Implement Date: 2025-01-04 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/ACCEM 338-2024
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: \nFrequency control and selection using piezoelectric devices and dielectric devices
Publish Date: 2024-12-05
Implement Date: 2025-01-04

Scope

Main technical content: the packaging materials, packaging equipment, packaging process flow, packaging quality, and testing of the surface acoustic wave filter chip device module structure and encapsulation process

Development Information

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