T/CI 834-2024 Active Group standards

T/CI 834-2024 Optical imaging resist solder paste and photoresist technical specifications

T/CI 834-2024 Optical imaging resist solder paste and photoresist technical specifications

Publish Date: 1970-01-01 Implement Date: 1970-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/CI 834-2024
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: -
Publish Date: 1970-01-01
Implement Date: 1970-01-01

Scope

This document specifies the technical requirements, inspection methods, and inspection rules for photo-imaging solder mask inks used in the manufacturing process of printed circuit boards (PCBs). This document is applicable to the development, production, and inspection of photo-imaging solder mask inks used in the manufacturing process of printed circuit boards (PCBs).

Development Information

Word Count: 15 Thousand words

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