GB/T 19405.4-2025 Active National standards

GB/T 19405.4-2025 Surface mounting technology—Part 4:Classification,packaging,labelling and handling of moisture sensitive devices

GB/T 19405.4-2025 Surface mounting technology—Part 4:Classification,packaging,labelling and handling of moisture sensitive devices

Publish Date: 2025-12-31 Implement Date: 2026-07-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Price: $ 56.00

Basic Information

Standard Code: GB/T 19405.4-2025

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Printed circuit board

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2025-12-31

Implement Date: 2026-07-01

Pages: 28 pages

Scope

This document specifies the requirements for the handling, marking, packaging, and classification of humidity-sensitive devices.
This document applies to all devices that use batch reflow soldering during PCB assembly, including plastic encapsulation, sensitive device process encapsulation, and all other encapsulations made from moisture-permeable materials (such as epoxy resin and silicone resin) that are exposed to ambient air.

Development Information

Word Count: 42 Thousand words Pages: 28 pages

Same series standard

GB/T 19405.3-2025 Surface mounting technology—Part 3:Standard method for the specification of components for through hole reflow(THR) soldering

Referenced Standards

GB/T 2036-1994 Terms for printed circuits GB/T 2421-1999 Environmental testing for electric and electronic products—Part 1:General and guidance GB/T 2421-2020 Environmental testing—General and guidance GB/T 2421.1-2008 Environmental testing for electric and electronic products—General and guidance GB/T 2421.2-2008 Environmental testing for electric and electronic products—Information for specification writers—Test summaries GB/T 4677-2002 Test methods of printed boards GB/T 19405.2-2003 Surface mounting technology—Part2:Transportation and storage conditions of surface mounting devices(SMD)—Application guide SJ/T 11200-2016 Environmental testing Part 2-58: Test TestTd: Test method for solderability of surface-mounted components, resistance to corrosion of metallized layers, and resistance to soldering heat

Adopt standards

IEC 61760-4:2018

Related Standards

GB/T 5489-1985 Replaced

GB/T 5489-1985 Printed board drawing

Publish Date: 1985-11-01

GB/T 12559-1990 Active

GB/T 12559-1990 The patternes series for artwork master of printed circuits

Publish Date: 1990-12-08

GB/T 12629-1990 Replaced

GB/T 12629-1990 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Publish Date: 1990-12-28

GB/T 12630-1990 Active

GB/T 12630-1990 Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards

Publish Date: 1990-12-28

GB/T 12631-1990 Replaced

GB/T 12631-1990 Test method for resistance of conductor of printed boards

Publish Date: 1990-12-28

GB/T 13555-1992 Replaced

GB/T 13555-1992 Flexible copper-clad polyimide film for printed circuits

Publish Date: 1992-07-08