T/TMAC 174-2025 Active Group standards

T/TMAC 174-2025 Flexible Copper Clad Laminate (FCCL) for use in Flexible Printed Circuit (FPC) substrates

Publish Date: 1970-01-01 Implement Date: 1970-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Price: $ 31.00

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Basic Information

Standard Code: T/TMAC 174-2025

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: -

Publish Date: 1970-01-01

Implement Date: 1970-01-01

Scope

This document specifies the technical requirements, inspection methods, inspection rules, marking, packaging, transportation, and storage for flexible copper-clad laminates (FCCL) used as substrates in flexible circuit boards. This document is applicable to the research, development, production, and inspection of flexible copper-clad laminates used as substrates in the manufacture of flexible circuit boards.

Development Information

Word Count: 15 Thousand words

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