GB/T 2413-1981
Active
T/CEMIA 038-2023
Active
Group standards
T/CEMIA 038-2023 Low temperature curable encapsulation paste for chip resistors
T/CEMIA 038-2023 Low temperature curable encapsulation paste for chip resistors
Price:
$ 31.00
Basic Information
Standard Code:
T/CEMIA 038-2023
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic devices and specialized materials, parts, and structural components
ICS Name:
Special materials for electronic technology
Publish Date:
2023-11-14
Implement Date:
2023-12-30
Pages:
16 pages
Scope
This document specifies the technical requirements, testing methods, inspection rules, and packaging, marking, transportation, and storage of low-temperature curing encapsulation slurry for chip resistors.
This document applies to low-temperature curing encapsulation slurry for chip resistors, which is composed of functional fillers, organic carriers, and additives and meets the requirements for printing characteristics (hereinafter referred to as "low-temperature curing encapsulation slurry").
Development Information
Referenced Standards
Related Standards
GB/T 3389.4-1982
Replaced
GB/T 3389.4-1982 Test methods for the properties of piezoelectric ceramics—Longitudinal length extension vibration mode for rod
GB/T 5594.1-1985
Active
GB/T 5594.1-1985 Test methods for properties of structure ceramic used in electronic components—Test method for gas-tightness
GB/T 5594.2-1985
Active
GB/T 5594.2-1985 Test methods for properties of structure ceramic used in electronic components—Test method for Youngs elastic modulus and Poisson ratio
GB/T 5594.3-1985
Replaced
GB/T 5594.3-1985 Test methods for properties of structure ceramic used in electronic components—Test method for mean coefficient of linear expansion
GB/T 5594.4-1985
Replaced