T/JSSIA 0003-2017 Active Group standards

T/JSSIA 0003-2017 Wafer-level Chip Size Package (WLCSP) family of products

T/JSSIA 0003-2017 Wafer-level Chip Size Package (WLCSP) family of products

Publish Date: 2017-09-29 Implement Date: 2017-10-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
Price: $ 20.00
Out of stock

Basic Information

Standard Code: T/JSSIA 0003-2017
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: Microcircuit
ICS Name: Integrated circuits, microelectronics
Publish Date: 2017-09-29
Implement Date: 2017-10-01

Scope

Scope: This standard specifies the series type spectrum of the packaging of integrated circuit products - wafer-level chip size packaging (WLCSP); Main technical content: This standard specifies the standard packaging series of wafer-level chip size packaging (WLCSP), as well as guidelines for selection and application, and is applicable to wafer-level chip size packaging.

Development Information

Related Standards

Contact Us