T/CASAS 020-2021 Active Group standards

T/CASAS 020-2021 Micro-nano metal sintering body thermal conductivity test method: flash method

Publish Date: 2021-11-01 Implement Date: 2021-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CASAS 020-2021

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: \nTest methods for the physical and chemical properties of metals

ICS Name: Integrated Components of Semiconductor Devices

Publish Date: 2021-11-01

Implement Date: 2021-12-01

Scope

Scope: This document specifies the test method for the thermal conductivity of micro-nano metal sintered bodies used in the packaging of third-generation semiconductor devices. This method is applicable to micro-nano metal sintered bodies, but does not include the determination of the thermal conductivity of micro-nano metal sintered parts. This method tests the thermal conductivity value of the sample at room temperature. It should be noted that this method is suitable for measuring the thermal conductivity from the front to the back of the sample (i.e., in the longitudinal direction), which is the same direction as the heat transfer direction of the device packaging sample. Main technical content: Metal interconnect materials play a key role in the semiconductor packaging industry. Traditional packaging uses solder alloy interconnects, but the precipitated intermetallic compounds lead to low service temperature and high brittleness of the interconnect layer. As one of the most suitable interface connection technologies for the packaging of third-generation semiconductor modules, the new micro-nano silver and micro-nano copper-based micro-nano metal sintered interconnect technology has the advantages of single component, low process temperature, and high service temperature. Moreover, the reliability of chip connectors can also be greatly improved, especially the sintered layer of micro-nano metal sintered parts often has low resistivity and high thermal conductivity, which makes it more suitable for future high-temperature and high-power density applications. Thermal conductivity, also known as thermal conductivity or heat transfer coefficient, is a physical quantity that indicates the heat transfer capability of materials. As an intrinsic parameter of materials, thermal conductivity is not directly related to the size and shape of materials, but is affected by material type, preparation process, and microstructure. For the connection layers prepared by mi