T/CI 360-2024 Active Group standards

T/CI 360-2024 IC package baseboard image detection system technical specifications

Publish Date: 2024-05-16 Implement Date: 2024-05-16 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CI 360-2024

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Printed circuit board

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2024-05-16

Implement Date: 2024-05-16

Scope

Main technical content: This document specifies the technical composition of the optical detection device for IC substrate packaging, the method of splicing the motherboard based on airspace fusion based on the main distance, the framework for defect detection of SMT mounted components based on matching feature fusion, and the requirements for the defect segmentation framework of SMT assembly based on element transfer learning and multi-scale fusion network. It provides methods for alleviating forgetful image incremental learning classification and detecting unknown abnormal samples based on energy distribution. This document is applicable to the research, design, and technical route of industrial IC packaging substrates and SMT assembly image detection systems, and can be used as a technical basis for the design and research of IC packaging substrates and SMT assembly automatic optical detection systems. It is suitable for industrial vision quality inspection of products in the 3C, chip, and other semiconductor industries, LED, OLED, and other new display panel industries, as well as battery module end plates and battery cells in the new energy industry.