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YS/T 678-2008
YS/T 678-2008 Copper wire for semiconductor lead bonding
Abstract
This standard specifies the requirements, test methods, inspection specifications, and markings for copper wires used in the bonding of semiconductor devices, as well as their packaging, transportation, storage, and the content of purchase orders (or contracts).
This standard applies to copper wires used in the bonding of semiconductor devices (hereinafter referred to as "copper wires").
General Product Information
| Document Type | Industry standards-Non-ferrous metals |
|---|---|
| Standard Status | Abolished |
| Standard Code | YS/T 678-2008 |
| CCS | Light metals and their alloys |
| ICS | Aluminum products |
| Implement Date | 2008-09-01 |
Price
$ 27
Subtotal
$ 27
Tax
$ 0.00
Order Total (incl. tax)
$ 27