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T/QGCML 2655-2023 Active
T/QGCML 2655-2023 Metal-base heat dissipation type board-to-board connector
Abstract
Main technical content: This document specifies the terms and definitions, structure and principle, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of metal substrate heat-dissipating cardboard connectors. This document is applicable to the production and inspection of metal substrate heat-dissipating cardboard connectors.
General Product Information
| Document Type | Group standards |
|---|---|
| Standard Status | Active |
| Standard Code | T/QGCML 2655-2023 |
| ICS | \nConnecting device |
| Implement Date | 2023-12-29 |
Price
$ 20.00
Subtotal
$ 20.00
Tax
$ 0.00
Order Total (incl. tax)
$ 20.00