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GB/T 4937.20-2018 Active
GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20:Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Abstract
This part of GB/T 4937 specifies the evaluation method for the resistance to welding heat of surface-mounted semiconductor devices (SMDs) in plastic packages. This test is a destructive test.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 4937.20-2018 |
| CCS | Semiconductor discrete devices |
| ICS | Integrated Components of Semiconductor Devices |
| Implement Date | 2019-01-01 |
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$ 75
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$ 75
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$ 75