GB/T 7289-2017 Active

This standard specifies how to use failure rate data to predict the reliability of electronic components in electronic devices.
The reference conditions are the typical values of component stress observed in a large number of applications. The reference conditions are useful because they can calculate the failure rate under any conditions by using a stress model that takes into account the actual working conditions. The failure rate under reference conditions can be used for actual reliability prediction in the early design stage.
The stress model described in this standard is a universal model that can be used as the basis for converting failure rate data under reference conditions to failure rate under actual working conditions when necessary, which simplifies the prediction method. The conversion of failure rate data is only allowed within the specified functional usage limits of the components.
This standard also provides guidance on how to build a database of component failure rates to provide failure rates that can be used in the stress model of this standard. The reference conditions for specifying failure rate data are designed to enable data from different sources to be compared on the same basis. If the failure rate data are given in accordance with this standard, there is no need for additional information on specific conditions.
This standard does not provide the basic failure rate of components, but provides a model to convert the failure rate obtained by other means from one working condition to another.
The prediction methods described in this standard all assume that the components are used during their service life. These methods are universal but are specifically applicable to the types of components given in Chapter 6 and Appendix E.2.