GB/T 5489-1985
Replaced
DB34/T 3367-2019
Active
Anhui ProvinceLocal standards
Test Method for Thermal Stress of Plated Holes on Printed Circuit Boards - DB34/T 3367-2019
DB34/T 3367-2019
Price:
$ 30
Basic Information
Standard Code:
DB34/T 3367-2019
Standard Type:
Local standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Printed circuit board
ICS Name:
Printed circuits and printed circuit boards
Publish Date:
2019-07-01
Implement Date:
2019-09-01
Pages:
7 pages
Scope
This standard specifies the equipment and reagents, test steps, and defect judgment and reporting for the thermal stress testing of plated holes on printed circuit boards. This standard applies to the thermal stress testing of plated holes with metal coatings on printed circuit boards.
Development Information
Related Standards
GB/T 12559-1990
Active
GB/T 12559-1990 The patternes series for artwork master of printed circuits
GB/T 12629-1990
Replaced
GB/T 12629-1990 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T 12630-1990
Active
GB/T 12630-1990 Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards
GB/T 12631-1990
Replaced
GB/T 12631-1990 Test method for resistance of conductor of printed boards
GB/T 13555-1992
Replaced