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GB/T 4937.21-2018 Active
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21:Solderability
Abstract
This part of GB/T 4937 specifies the solderability test procedures for the lead-free solder or lead-free solder used in the packaging and lead-out terminals of components.
This test method specifies the "immersion and observation" solderability test procedures for through-hole, axial, and surface-mount devices (SMDs), as well as optional solderability test procedures for SMDs on boards, used to simulate the soldering process employed when the components are in use. This test method also specifies the aging conditions, which are optional.
Unless otherwise specified in relevant documents, this test is a destructive test.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 4937.21-2018 |
| CCS | Semiconductor discrete devices |
| ICS | Integrated Components of Semiconductor Devices |
| Implement Date | 2019-01-01 |
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