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YS/T 543-2015

YS/T 543-2015 Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding

Available format(s)
PDF
Language(s)
Chinese
Publish Date
2015-04-30

Abstract

This standard specifies the requirements, test methods, inspection rules, and packaging, marking, transportation, storage, as well as the contents of quality certificates and purchase orders (or contracts) for aluminum-1% silicon fine wires used in the bonding of semiconductor devices.
This standard applies to drawn or extruded aluminum-1% silicon fine wires (hereinafter referred to as fine wires) used for internal wiring in semiconductors.

General Product Information

Document Type Industry standards-Non-ferrous metals
Standard Status Abolished
Standard Code YS/T 543-2015
CCS Light metals and their alloys
ICS Semiconductor materials
Implement Date 2015-10-01
Price $ 27
Subtotal $ 27
Tax $ 0.00
Order Total (incl. tax) $ 27

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