DZ/T 0101.12-1994
Active
SJ/Z 21355-2018
Active
Industry standards-Electronics
SJ/Z 21355-2018 Design guidelines for hermetic package of SiP products
SJ/Z 21355-2018 Design guidelines for hermetic package of SiP products
Price:
$ 30
Basic Information
Standard Code:
SJ/Z 21355-2018
Standard Type:
Industry standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
-
Publish Date:
2018-01-18
Implement Date:
2018-05-01
Pages:
10 pages
Scope
This guidance technical document specifies the design requirements for the airtight encapsulation of system-level packaging (SiP) products, including general requirements, materials, structures, and design requirements for different airtight welding processes such as brazing, parallel seam welding, and laser welding. This guidance technical document is applicable to the airtight encapsulation design of SiP products.
Development Information
Referenced Standards
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