T/ZZB 3330-2023 Active
T/ZZB 3330-2023 155th Low Temperature Soldered Copper Round Line Coated with Polyurethane Tin Paint
Abstract
Main technical content: This document specifies the basic requirements, technical requirements, test methods, inspection rules, labels, packaging, transportation, storage, and quality commitments for 155-grade low-temperature solderable polyurethane-coated copper round wires (hereinafter referred to as "solderable polyurethane-coated copper round wires"). This document is applicable to polyurethane-coated copper round wires with a minimum temperature index of 155 °C, a thermal shock temperature of at least 175 °C, and a solder temperature of (375±5) °C. The nominal diameter range of the conductors specified in this document is: Level 1: 0.050 mm and above, 1.000 mm and below; Level 2: 0.050 mm and above, 1.000 mm and below.
General Product Information
| Document Type | Group standards |
|---|---|
| Standard Status | Active |
| Standard Code | T/ZZB 3330-2023 |
| CCS | Wire with an insulating layer |
| ICS | Comprehensive overview of wires and cables |
| Implement Date | 2023-11-20 |