T/QGCML 3081-2024 Active Group standards

T/QGCML 3081-2024 Semiconductor sputtering target material high purity titanium metal powder

Publish Date: 2024-01-31 Implement Date: 2024-02-15 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/QGCML 3081-2024

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Powder metallurgy

Publish Date: 2024-01-31

Implement Date: 2024-02-15

Scope

Main technical content: This document specifies the terms and definitions, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of high-purity titanium metal powder for semiconductor sputtering targets. This document is applicable to the production and inspection of high-purity titanium metal powder for semiconductor sputtering targets.

Development Information

Related Standards

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GB/T 4309-1984 Replaced

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GB/T 5124.1-1985 Replaced

GB/T 5124.1-1985 Methods for chemical analysis of hardmetals—The gravimetric method for the determination of total carbon content

Publish Date: 1985-04-24

GB/T 5124.2-1985 Replaced

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Publish Date: 1985-04-24

GB/T 5124.3-1985 Replaced

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Publish Date: 1985-04-24

GB/T 5124.4-1985 Replaced

GB/T 5124.4-1985 Methods for chemical analysis of hardmetals—The photometric peroxide method for the determination of titanium content

Publish Date: 1985-04-24