GB/T 44795-2024 Active National standards

GB/T 44795-2024 General requirements for integral substrate of System in Package(SiP)

Publish Date: 2024-10-26 Implement Date: 2024-10-26 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: GB/T 44795-2024

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Semiconductor integrated circuits

ICS Name: Integrated circuits, microelectronics

Publish Date: 2024-10-26

Implement Date: 2024-10-26

Pages: 24 pages

Scope

This document specifies the general requirements for system-level packaging (SiP) integrated substrates, including the overall requirements for integrated substrates, feature definitions, design, verification, manufacturing, inspection, delivery, product transfer, storage, and other requirements.
This document is applicable to the bottom substrates that become an integral part of the finished enclosure in system-level packaging (SiP).

Development Information

Word Count: 36 Thousand words Pages: 24 pages

Referenced Standards

GB/T 9178-1988 Terminology for integrated circuits GB/T 12842-1991 Terminology for film integrated circuits and hybrid film integrated circuits GB/T 44801-2024 Terminology of system in package(SiP)

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